DSCSY
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company's precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation. It also offers precision processing tools comprising dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, as well as frames and cassettes, and additives for cutting waters. In addition, the company is involved in the disassembly and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its products. Further, it leases precision machines; and purchases and sells used machines. The company was founded in 1937 and is headquartered in Tokyo, Japan.
| Period | EPS | Revenue | FCF |
|---|---|---|---|
| 2026 Q4 | 39.95 | $135.5B | — |
| 2025 Q3 | 34.48 | $111.3B | — |
| 2025 Q2 | 30.20 | $106.4B | — |
| 2025 Q1 | 21.92 | $89.9B | $0 |
| 2025 Q4 | 35.65 | $120.7B | $0 |
| 2024 Q3 | 29.35 | $93.6B | $0 |
| 2024 Q2 | 27.44 | $96.2B | $0 |
| 2024 Q1 | 21.88 | $82.8B | $0 |